Advanced FIB & TEM For Wafers Analysis
Delivery term:The date of payment from buyers deliver within days-
Price:
Negotiable
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- Total supply:
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Delivery term:
The date of payment from buyers deliver within days
- seat:
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Validity to:
Long-term effective
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Last update:
2026-10-17 02:41
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Browse the number:
4
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GRG METROLOGY & TEST GROUP CO., LTD.
- Contactaixin:
Contactaixin:
maguby(Ms.)
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Email:
telephone:
phone:
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Area:
Address:
No.8 Chuangyun Road, Shiqi Town, Panyu District, Guangzhou City,China
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GRGTEST Metrology possesses patented technologies including methods for eliminating the curtain effect of the FIB focused ion beam, a novel framework structure method for preparing heat-sensitive TEM ultrathin samples using DB FIB, a FIB step-thinning method for preparing ultrathin TEM samples of brittle and easily cracked materials, a focused ion beam ultrathin sectioning pretreatment method for radiation-sensitive fine-structure wafer samples, and a method for preparing TEM samples using FIB inverted cutting. These technologies enable high-resolution TEM images with no electron beam damage, achieving atomic-level resolution morphological characterization and compositional analysis of advanced process chips.
link:http://www.grgtmall.net
link:http://www.grgtmall.net
